Package assembly

ABSTRACT

The present disclosure, in some embodiments, relates to an integrated chip structure. The integrated chip structure includes a bump structure disposed on a first substrate and a molding compound in physical contact with the bump structure. The bump structure protrudes from the molding compound. A conductive region is on a second substrate and contacts the bump structure. A no-flow underfill (NUF) material is vertically between the molding compound and the second substrate and laterally surrounds the bump structure. The NUF material is separated from the molding compound.

REFERENCE TO RELATED APPLICATIONS

This Application is a Continuation of U.S. application Ser. No.15/712,680, filed on Sep. 22, 2017, which is a Continuation of U.S.application Ser. No. 14/713,476, filed on May 15, 2015 (now U.S. Pat.No. 9,780,064, issued on Oct. 3, 2017), which is a Divisional of U.S.application Ser. No. 13/427,787, filed on Mar. 22, 2012 (now U.S. Pat.No. 9,059,109, issued on Jun. 16, 2015), which claims the benefit ofU.S. Provisional Application No. 61/590,255, filed on Jan. 24, 2012. Thecontents of the above-referenced Patent Applications are herebyincorporated by reference in their entirety.

TECHNICAL FIELD

This disclosure relates to the fabrication of package assemblies and,more particularly, to the fabrication of package assemblies forsemiconductor devices.

BACKGROUND

Modern integrated circuits are made up of literally millions of activedevices such as transistors and capacitors. These devices are initiallyisolated from each other, but are later interconnected together to formfunctional circuits. Typical interconnect structures include lateralinterconnections, such as metal lines (wirings), and verticalinterconnections, such as vias and contacts. Interconnections areincreasingly determining the limits of performance and the density ofmodern integrated circuits. On top of the interconnect structures, bondpads are formed and exposed on the surface of the respective chip.Electrical connections are made through bond pads to connect the chip toa package substrate or another die. Bond pads can be used for wirebonding or flip-chip bonding. Flip-chip packaging utilizes bumps toestablish electrical contact between a chip's input/output (I/O) padsand a substrate or lead frame of a package. Structurally, a bumpactually contains the bump itself and an “under bump metallurgy” (UBM)located between the bump and the I/O pad.

Wafer level chip scale packaging (WLCSP) is currently widely usedbecause WLCSP is low cost and has relatively simple processes. In atypical WLCSP, post-passivation interconnect (PPI) lines such asredistribution lines (RDLs) are formed on passivation layers, followedby the formation of polymer films and bumps. A ball placement or a balldrop process is utilized in the WLCSP technology, but the ball dropperformance is still a concern.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-5 are cross-sectional views of a semiconductor die at variousintermediate stages of a method of forming a semiconductor device inaccordance with exemplary embodiments;

FIG. 6 is a cross-sectional view of a package substrate in accordancewith an exemplary embodiment; and

FIG. 7 is a cross-sectional view of a package assembly in accordancewith an exemplary embodiment.

DETAILED DESCRIPTION

The making and using of the embodiments of the disclosure are discussedin detail below. It should be appreciated, however, that the embodimentsprovide many applicable inventive concepts that can be embodied in awide variety of specific contexts. The specific embodiments discussedare merely illustrative of specific ways to make and use theembodiments, and do not limit the scope of the disclosure. Embodimentsdescribed herein relate to the use of bump structures for use withsemiconductor devices. As will be discussed below, embodiments aredisclosed that utilize a bump structure for the purpose of attaching onesubstrate to another substrate, wherein each substrate may be a die,wafer, interposer substrate, printed circuit board, packaging substrate,or the like, thereby allowing for die-to-die, wafer-to-die,wafer-to-wafer, die or wafer to interposer substrate or printed circuitboard or packaging substrate, or the like. Throughout the various viewsand illustrative embodiments, like reference numerals are used todesignate like elements.

Reference will now be made in detail to exemplary embodimentsillustrated in the accompanying drawings. Wherever possible, the samereference numbers are used in the drawings and the description to referto the same or like parts. In the drawings, the shape and thickness maybe exaggerated for clarity and convenience. This description will bedirected in particular to elements forming part of, or cooperating moredirectly with, an apparatus in accordance with the present disclosure.It is to be understood that elements not specifically shown or describedmay take various forms well known to those skilled in the art. Further,when a layer is referred to as being on another layer or “on” asubstrate, it may be directly on the other layer or on the substrate, orintervening layers may also be present. Reference throughout thisspecification to “one embodiment” or “an embodiment” means that aparticular feature, structure, or characteristic described in connectionwith the embodiment is included in at least one embodiment. Thus, theappearances of the phrases “in one embodiment” or “in an embodiment” invarious places throughout this specification are not necessarily allreferring to the same embodiment. Furthermore, the particular features,structures, or characteristics may be combined in any suitable manner inone or more embodiments. It should be appreciated that the followingfigures are not drawn to scale; rather, these figures are merelyintended for illustration.

FIGS. 1-5 are cross sectional views of a semiconductor die at variousintermediate stages of a method of forming a semiconductor device inaccordance with some embodiments.

Referring first to FIG. 1, a semiconductor substrate 102 includes asubstrate 10, an electrical circuitry 12, an inter-layer dielectric(ILD) layer 14, inter-metal dielectric (IMD) layers 16 and theassociated metallization layers.

A portion of the substrate 10 having electrical circuitry 12 formedthereon is shown, in accordance with some embodiments. The substrate 10may comprise, for example, bulk silicon, doped or undoped, or an activelayer of a semiconductor-on-insulator (SOI) substrate. The substrate 10may be provided as a wafer level scale or a chip level scale. Othersubstrates, such as a multi-layered or gradient substrate may also beused.

Electrical circuitry 12 formed on the substrate 10 may be any type ofcircuitry suitable for a particular application. In some embodiments,the electrical circuitry 12 includes electrical devices formed on thesubstrate 10 having one or more dielectric layers overlying theelectrical devices. Metal layers may be formed between dielectric layersto route electrical signals between the electrical devices. Electricaldevices may also be formed in one or more dielectric layers. Forexample, the electrical circuitry 12 may include various N-typemetal-oxide semiconductor (NMOS) and/or P-type metal-oxide semiconductor(PMOS) devices, such as transistors, capacitors, resistors, diodes,photo-diodes, fuses, and the like, interconnected to perform one or morefunctions. The functions may include memory structures, processingstructures, sensors, amplifiers, power distribution, input/outputcircuitry, or the like. One of ordinary skill in the art will appreciatethat the above examples are provided for illustrative purposes only tofurther explain applications of some illustrative embodiments and arenot meant to limit the disclosure in any manner. Other circuitry may beused as appropriate for a given application.

The ILD layer 14 may be formed, for example, of a low-K dielectricmaterial, such as phosphosilicate glass (PSG), borophosphosilicate glass(BPSG), fluorinated silicate glass (FSG), SiO_(x)C_(y), Spin-On-Glass,Spin-On-Polymers, silicon carbon material, compounds thereof, compositesthereof, combinations thereof, or the like, by any suitable method, suchas spinning, chemical vapor deposition (CVD), and/or plasma-enhanced CVD(PECVD). In some embodiments, the ILD layer 14 may comprise a pluralityof dielectric layers. Contacts (not shown) may be formed through the ILDlayer 14 to provide an electrical connection to the electrical circuitry12.

One or more inter-metal dielectric (IMD) layers 16 and the associatedmetallization layers are formed over the ILD layer 14. Generally, theone or more IMD layers 16 and the associated metallization layers (suchas metal lines 18 and vias 19) are used to interconnect the electricalcircuitry 12 to each other and to provide an external electricalconnection. The IMD layers 16 may be formed of a low-K dielectricmaterial, such as FSG formed by PECVD techniques or high-density plasmaCVD (HDPCVD), or the like, and may include intermediate etch stoplayers. In some embodiments, one or more etch stop layers (not shown)may be positioned between adjacent ones of the dielectric layers, e.g.,the ILD layer 14 and the IMD layers 16. Generally, the etch stop layersprovide a mechanism to stop an etching process when forming vias and/orcontacts. The etch stop layers are formed of a dielectric materialhaving a different etch selectivity from adjacent layers, e.g., theunderlying semiconductor substrate 10, the overlying ILD layer 14, andthe overlying IMD layers 16. In some embodiments, etch stop layers maybe formed of SiN, SiCN, SiCO, CN, combinations thereof, or the like,deposited by CVD or PECVD techniques.

In some embodiments, the metallization layers, including metal lines 18and vias 19, may be formed of copper or copper alloys, or of othermetals. Further, the metallization layers include a top metal layer 20formed and patterned in or on an uppermost IMD layer to provide externalelectrical connections and to protect the underlying layers from variousenvironmental contaminants. In some embodiments, the uppermost IMD layeris formed of a dielectric material, such as silicon nitride, siliconoxide, undoped silicon glass, and the like. In subsequent drawings,semiconductor substrate 10, electrical circuitry 12, ILD layer 14, andmetallization layers 18 and 19 are not illustrated. In some embodiments,the top metal layer 20 is formed as a part of the top metallizationlayer on the uppermost IMD layer.

Thereafter, a contact pad 104 is formed and patterned to contact the topmetal layer 20, or alternatively, electrically coupled to top metallayer 20 through a via. In some embodiments, the contact pad 104 may beformed of aluminum, aluminum copper, aluminum alloys, copper, copperalloys, or the like. One or more passivation layers, such as apassivation layer 106 are formed and patterned over the contact pad 104.In some embodiments, the passivation layer 106 may be formed of adielectric material, such as undoped silicate glass (USG), siliconnitride, silicon oxide, silicon oxynitride or a non-porous material byany suitable method, such as CVD, PVD, or the like. The passivationlayer 106 is formed to cover a peripheral portion of the contact pad104, and to expose a central portion of the contact pad 104 through anopening in passivation layer 106. The passivation layer 106 may be asingle layer or a laminated layer. In FIG. 1, a single layer of thecontact pad 104 and the passivation layer 106 are shown for illustrativepurposes only. As such, other embodiments may include any number ofconductive layers and/or passivation layers.

Next, a first protective layer 108 is formed and patterned over thepassivation layer 106. In some embodiments, the first protective layer108 may be, for example, a polymer layer, which is patterned to form anopening 109, through which the contact pad 104 is exposed. In someembodiments, the polymer layer is formed of a polymer material such asan epoxy, polyimide, benzocyclobutene (BCB), polybenzoxazole (PBO), andthe like, although other relatively soft, often organic, dielectricmaterials can also be used. The formation methods include spin coatingor other methods. The first protective layer 108 has a thickness in arange between about 1 μm and about 10 μm. For example, a thicknessbetween about 5 μm and about 8 μm.

Referring to FIG. 2 at least one metallization layer 110 is formed onthe first protective layer 108 and fills the opening 109. Themetallization layer patterned as an interconnect layer, which iselectrically connected to the contact pad 104 and may expose a portionof the underlying first protective layer 108. In at least an embodiment,the interconnect layer 110 is a post-passivation interconnect (PPI)layer 110, which may also functions as power lines, re-distributionlines (RDL), inductors, capacitors or any passive components. The PPIlayer 110 includes an interconnect line region 110A and a landing padregion 110B. In some embodiments, the interconnect line region 110A andthe landing pad region 110B may be formed simultaneously, and may beformed of a same conductive material. A bump feature will be formed overand electrically connected to the landing pad region 110B in subsequentprocesses. In some embodiments, the PPI layer 110 includes copper,aluminum, copper alloy, or other mobile conductive materials usingplating, electroless plating, sputtering, chemical vapor depositionmethods, and the like. In some embodiments, the PPI layer 110 includes acopper layer or a copper alloy layer. In the embodiment of FIG. 2, thelanding region 110B is not directly over the contact pad 104. In otherembodiments, through the routing of PPI layer 110, the landing padregion 110B is directly over the contact pad 104.

With reference to FIG. 2, a second protective layer 112 is then formedon the PPI layer 110. Using photolithography and/or etching processes,the second protective layer 112 is patterned to form an opening 113exposing at least a portion of the landing pad region 110B of the PPIlayer 110. The formation methods of the opening 113 may includelithography, wet or dry etching, laser drilling, and/or the like. Insome embodiments, the second protective layer 112 is formed of a polymerlayer, such as an epoxy, polyimide, benzocyclobutene (BCB),polybenzoxazole (PBO), and the like, although other relatively soft,often organic, dielectric materials may also be used. In someembodiments, the second protective layer 112 is formed of a non-organicmaterial selected from un-doped silicate glass (USG), silicon nitride,silicon oxynitride, silicon oxide, and combinations thereof.

As shown in FIG. 3, an under-bump metallization (UBM) layer 114 isformed on the exposed portion of the landing pad region 110B. UBM layer114 is formed so as to electrically connect to the PPI layer 110. Insome embodiments, the UBM layer 114 may extend to a surface of thesecond protective layer 112. The formation methods of the UBM layer 114include photoresist coating, lithography, wet or dry etching, and/or thelike. In some embodiments, the UBM layer 114 includes at least onemetallization layer comprising titanium (Ti), tantalum (Ta), titaniumnitride (TiN), tantalum nitride (TaN), copper (Cu), copper alloys,nickel (Ni), tin (Sn), gold (Au), or combinations thereof. In someembodiments, the UBM layer 114 includes at least one Ti-containing layerand at least one Cu-containing layer.

As shown in FIG. 4, a bump 118 is formed on the UBM layer 114. The bump118 can be a solder bump, a Cu bump or a metal bump including Ni or Au.In some embodiments, the bump 118 is a solder bump formed by attaching asolder ball to the UBM layer 114 and then thermally reflowing the soldermaterial. In an embodiment, the solder bump has a diameter greater thanabout 200 μm. In some embodiments, the solder bump includes a lead-freepre-solder layer, SnAg, or a solder material including alloys of tin,lead, silver, copper, nickel, bismuth, or combinations thereof. In someembodiments, the solder bump is formed by plating a solder layer usingphotolithography technologies followed by reflow processes.

Next, as shown in FIG. 5, a molding compound layer 116 is applied on thesecond protective layer 112, where the bump 118 is partially buried inthe molding compound layer 116. In some embodiments, the moldingcompound layer 116 is in physical contact with a lower portion of thebump 118, while an upper portion of the bump 118 is exposed andprotrudes from a top surface 116A of the molding compound layer 116. Insome embodiments, a top portion 118T of the bump 118 is higher than thetop surface 116A of the molding compound layer 116. In some embodiments,the bump 118 is not polished after the reflow, and the top portion 118Tof the bump 118 above the top surface 116A of the molding compound layer116 may remain to have a rounded-like profile. The molding compoundlayer 116 may be in physical contact with the second protective layer112 and/or the UBM layer 114. In some embodiments, a height (H1) of thebump 118 that is buried in the molding compound layer 116 may be betweenabout ¼ to ¾ of a total height H2 of the bump 118. In at least oneembodiment, the molding compound layer 116 is formed by applying aliquid molding compound and performing a curing process to cure andsolidify the liquid molding compound. In some embodiments, a releasefilm or a soft material may be applied on the liquid molding compound.Pressure is applied on the release film on the liquid molding compound,so that a portion of the bump 118 is pressed into release film.Furthermore, the pressure applied on the release film may push some ofliquid molding compound downward. While the pressure is applied to therelease film pushing against the bump and the liquid molding compound, acuring may be performed to cure and solidify liquid molding compound.After the solidification, the top portion 118T of the bump 118 is lowerthan the top surface 116A of molding compound layer 116. Thereafter, therelease film is peeled off the molding compound layer 116, which is nowin a solid form. The molding compound layer 116 residue remaining on thetop portion 118T of the bump 118 is then etched. In the resultingstructure, the molding compound layer 116 is formed with a portion ofthe bump 118 buried therein.

After the bump formation, for example, an encapsulant may be formed, asingulation process may be performed to singulate individual dies 100and wafer-level or die-level stacking or the like may be performed.Embodiments may be used in many different situations. For example,embodiments may be used in a die-to-die bonding configuration, adie-to-wafer bonding configuration, a wafer-to-wafer bondingconfiguration, die-level packaging, wafer-level packaging, or the like.In some embodiments, the semiconductor die 100 shown in FIG. 5 isflipped upside down and attached to another substrate 200 as depicted inFIG. 6.

FIG. 6 is a cross-sectional view of a package substrate in accordancewith an exemplary embodiment. In some embodiments, the substrate 200 maybe a package substrate, board (e.g., a printed circuit board (PCB)), awafer, a die, an interposer substrate, or other suitable substrate. Thebump 118 of the semiconductor die 100 can be electrically coupled to thesubstrate 200 through various conductive attachment points. For example,a conductive region 202 is formed and patterned on the substrate 200.The conductive region 202 is a contact pad or a portion of a conductivetrace, which is exposed by an opening in a mask layer 204. In someembodiments, the mask layer 204 is a solder resist layer formed andpatterned on the substrate 200 to expose the conductive region 202. Themask layer 204 has a mask opening, which provides a window for jointing.

In at least on embodiment, a no-flow underfill (NUF) layer 206 is formedon the conductive region 202 within the window of the mask layer 204prior to mounting the semiconductor die 100 to the substrate 200. TheNUF material combines underfill and flux into a single material as ahybrid underfill-flux. The NUF layer 206 may act as fluxing agent forthe solder reflow and form a solid during reflow cycle that reinforcesthe interconnects. Using the NUF material provides significant costsavings as it reduces the number of process steps used to bond thesemiconductor die 100 to the substrate 200 and increases the throughputof the process. In some embodiments, the no-flow underfill material isdeposited on the conductive region 202 using spin coating, dispensing,or lamination. The NUF material may be an epoxy resin having a highcoefficient of thermal expansion (CTE) and high glass transitiontemperature. The volume deposition of the NUF material can be controlledto a thickness that covers a major portion of the conductive region 202and exposes the remainder of the mask layer 204.

FIG. 7 is a cross-sectional diagram depicting an exemplary embodiment ofa package assembly. In some embodiments, the semiconductor die 100 canbe electrically coupled to the substrate 200, in which the bump 118 isin physical contact with the NUF layer 206 and electrically connected tothe conductive region 202 so as to form an interconnected jointstructure 208 between the die 100 and the substrate 200. In someembodiments, the upper portion of the bump 118 is in physical contactwith the NUF layer 206, and the top portion 118T of the bump 118 iselectrically connected to the conductive region 202. For example, thesemiconductor die 100 can be attached to the substrate 200 by heatingthe substrate 200, dispensing the NUF layer 206 on the substrate,positioning the bump 118 of the semiconductor die 100 on/in the NUFlayer 206 and then using a thermal-compression bonding process to reflowand attach the die 100 to the substrate 200. During reflow, the fluxembedded in the NUF layer 206 activates and allows the solder bump toreflow and form the interconnected joint structure 208. After reflow,further curing of underfill may be performed. Therefore, thesemiconductor die 100, the interconnected joint structure 208, and thesubstrate 200 are completed as a package assembly 300, or in the presentembodiment, a flip-chip package assembly. By forming the moldingcompound layer 116 around the lower portion of the bump 118, the thermalcycling life of the package assembly can be enhanced. By applying theNUF layer 206 on the substrate 200, the solder ball drop performance canbe further improved.

One aspect of this description relates to a method of forming a packageassembly. The method includes forming a no-flow underfill layer on asubstrate. The method further includes attaching a semiconductor die tothe substrate. The semiconductor die comprises a bump and a moldingcompound layer in physical contact with a lower portion of the bump. Anupper portion of the bump is in physical contact with the no-flowunderfill layer.

Another aspect of this description relates to a method of forming apackage assembly. The method includes forming a bump on a firstsubstrate, and forming a molding compound layer on the first substrate,being in physical contact with a lower portion of the bump. The methodfurther includes forming a no-flow underfill layer on a secondsubstrate. The method further includes attaching the first substrate tothe second substrate, wherein the second substrate comprises a no-flowunderfill layer on a conductive region. An upper portion of the bump isin physical contact with the no-flow underfill layer and electricallyconnected to the conductive region so as to form an interconnected jointstructure between the first substrate and the second substrate.

Still another aspect of this description includes a method of forming apackage assembly. The method includes forming a no-flow underfill layeron a conductive region of a substrate, wherein a mask layer is over thesubstrate, and the no-flow underfill layer exposes at least a portion ofthe mask layer. The method further includes bonding a bump of asemiconductor die to the conductive region, wherein the semiconductordie comprises a molding compound layer in contact with a portion of thebump.

In the preceding detailed description, the disclosure is described withreference to specific exemplary embodiments thereof. It will, however,be evident that various modifications, structures, processes, andchanges may be made thereto without departing from the broader spiritand scope of the disclosure. The specification and drawings are,accordingly, to be regarded as illustrative and not restrictive. It isunderstood that the disclosure is capable of using various othercombinations and environments and is capable of changes or modificationswithin the scope of inventive concepts as expressed herein.

What is claimed is:
 1. An integrated chip structure, comprising: a bumpstructure disposed on a first substrate; a molding compound in physicalcontact with the bump structure, wherein the bump structure protrudesfrom the molding compound; a conductive region on a second substrate andcontacting the bump structure; and a no-flow underfill (NUF) materialvertically between the molding compound and the second substrate andlaterally surrounding the bump structure, wherein the NUF material isseparated from the molding compound.
 2. The integrated chip structure ofclaim 1, wherein the bump structure protrudes outward from a top of theNUF material towards the first substrate.
 3. The integrated chipstructure of claim 1, wherein the NUF material comprises an epoxy resin.4. The integrated chip structure of claim 1, wherein the NUF materialhas a curved upper surface facing away from the second substrate.
 5. Theintegrated chip structure of claim 4, further comprising: a mask layerdisposed between the NUF material and the second substrate, wherein thecurved upper surface of the NUF material has a first end contacting themask layer and a second end contacting the bump structure.
 6. Theintegrated chip structure of claim 1, wherein a top of the NUF materialcontacts a side of the bump structure at a position that is laterallyset back from an outermost boundary of the bump structure.
 7. Theintegrated chip structure of claim 1, wherein the bump structurecontinuously extends from above a top of the molding compound to below abottom of the molding compound.
 8. The integrated chip structure ofclaim 1, wherein the molding compound has a lower surface facing acurved surface of the NUF material, the lower surface extending pastoutermost edges of the NUF material in opposing directions.
 9. A packageassembly, comprising: a conductive bump on a first substrate; a soldermask on a second substrate; a no-flow underfill layer disposed alongsidewalls and an upper surface of the solder mask; and wherein theconductive bump extends from a conductive region on the second substrateto over a top of the no-flow underfill layer.
 10. The package assemblyof claim 9, wherein the conductive bump has a first curved surface thatintersects a second curved surface of the no-flow underfill layer. 11.The package assembly of claim 9, wherein the first substrate comprises asemiconductor die and the second substrate comprises a printed circuitboard.
 12. The package assembly of claim 9, wherein the no-flowunderfill layer contacts one or more surfaces of the conductive region.13. The package assembly of claim 9, further comprising: a moldingcompound disposed on the first substrate and physically contacting sidesof the conductive bump, wherein the conductive bump protrudes outwardfrom the molding compound towards the conductive region.
 14. The packageassembly of claim 13, wherein a largest height of the conductive bumpthat the molding compound physically contacts is in a range of betweenapproximately one-fourth and approximately three-fourths of a totalheight of the conductive bump.
 15. The package assembly of claim 9,wherein a line that is normal to an upper surface of the secondsubstrate and that extends along an outer edge of the conductive regionalso extends through a curved surface of the no-flow underfill layer.16. A package assembly, comprising: a conductive bump on a firstsubstrate; a no-flow underfill layer on a second substrate, wherein theno-flow underfill layer has a curved surface extending from a conductiveregion on the second substrate to a top of the no-flow underfill layer;and wherein the conductive bump comprises a curved conductive surfacethat directly contacts an entirety of the curved surface of the no-flowunderfill layer.
 17. The package assembly of claim 16, wherein an outeredge of the conductive region is directly below the curved surface ofthe no-flow underfill layer.
 18. The package assembly of claim 16,further comprising: a molding compound disposed on the first substrateand contacting sides of the conductive bump, wherein the conductive bumpprotrudes outward from a bottom surface of the molding compound towardsthe conductive region.
 19. The package assembly of claim 18, wherein theconductive bump continuously extends from above a top surface of themolding compound to below the bottom surface of the molding compound.20. The package assembly of claim 18, wherein the bottom surface of themolding compound extend past the no-flow underfill layer in opposingdirections.